QUIP Package

The Intel iAPX 432 components were initially offered in a 64-pin QUad Inline Package (QUIP), which was apparently devloped in conjunction with 3M. The QUIP is a cavity-down ceramic leadless package with two opposing sides of the package each having two rows of sixteen contacts each. The package also has contacts on the top which remain uncovered by the socket's retaining clip in order to serve as probe test points.

In that time frame, there were no IC packages with more than 48 leads in common use in the US except for the 64 pin DIP. The QUIP was considered to have several advantages over the DIP:

The QUIP footprint is less than 2/3 the size of the DIP.
The QUIP package supports devices with higher power dissipation due to the heat sink inherent in the retaining clip.
Due to the smaller package size, the overall length of the conductors from the die to the contacts is short, and has lower inductance.

3M offered a production QUIP socket, part number 3534, and a test/burn-in socket (rated for temperatures to 200C), part number 3362.

Photograph of iAPX 432 components, courtesy of Clinton Harrold

As far as I know, the QUIP was only used by Intel, and only for the iAPX 432. The QUIP was obsoleted by the 68-contact JEDEC Type A ceramic leadless chip carrier, which was used by many vendors. The CLCC has since been replaced by PGA and BGA packages.

Note there is another, unrelated type of QUIP package that was commonly used by Rockwell. This package had leads on 0.05 inch centers, which were formed such that alternate leads extended an additional 0.1 inches from the package body.

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Last updated February 4, 2000

eric@brouhaha.com

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